LED TECHNOLOGY

LED stands for Light Emitting Diode, and this light source should not be confused with a light fixture or luminaire. LED is a component of the entire fixture. LED lighting can also be referred to as solid-state lighting (SSL) because LED is a solid-state technology similar to the memory in your computer.

LEDs consists of four main parts: die, substrate, phosphor and lens. The LED die is a semiconductor device made of gallium nitride (GaN). When electric current passes through the die, it emits blue light. One or more die are then mounted to a substrate commonly made of aluminum or ceramic. This allows easier integration of the LED into a fixture and provides an efficient way to bring power to the LED.

For general lighting applications, white light is generally desired, not blue. In order to achieve the target color, phosphor is used. When the blue light hits phosphor particles, they glow and emit white light. The phosphor can be applied to the die directly, or it can be mixed into the lens material, which typically consists of silicon or glass. The lens extracts and directs the light emitted from the die.

There are two standard configurations of an LED—emitters and COBs.
An emitter is a single die mounted to a substrate. The emitter is mounted to a circuit board, which is then mounted to a heat sink. This circuit board provides electrical power to the emitter, while also drawing away heat.

To help reduce cost and increase light uniformity, researchers discovered that the substrate of the LED can be removed and the die can be mounted directly to the circuit board. This configuration is known as a chip-on-board array, or COB.

At Ogen Led, we go beyond all of the above. Our lights are solid and can withstand impact, due to an innovative WFC (Wire-Free Chips) technology, which improves their stability and thermal ability in 200%.

Until recently, the COB (Chips on Board) technology was the only one available. However, in COB, the chips and wire were simply glued against the board, in a very fragile arrangement, which led to higher maintenance rates when bumps occurred. With the new WFC technique, chips are directly soldered into the board with a metal paste (high conductor), while acting as bridges, making the LED light much stronger and more immune to impact.